View source for Tempress S1T4 - LTO 6"

{{#vardefine:toolid|30071}}{{#vardefine:technology|LPCVD}}{{#vardefine:restriction|1}}{{infobox equipment
|caption = 
|materials = 
|mask =
|size = 150mm
|chemicals =
|gases = [[Nitrogen|N<sub>2</sub>]], [[Oxygen|O<sub>2</sub>]], [[Silane|SiH<sub>4</sub>]]
|overview = [[{{PAGENAME}}#System_Overview | System Overview]]
|sop = [https://docs.google.com/document/d/1XXxpN1Fjl3aDmdVX4JXbbXolBuEG2k92zDFAA0Po0EY/preview SOP]
|processes = [[{{PAGENAME}}#Supported_processes|LTO]]
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
}}
The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, [[MEMS]], and solar devices. [[LTO]] is formed by using a process called [[LPCVD]], Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure.

==Announcements==
* There are no announcements at this time.

==Capabilities==
* [[Silicon dioxide|Low Temperature Oxide]] - LTO
* Maximum Thickness - 2µm

==System overview==
===Hardware details===
* [[Nitrogen|N<sub>2</sub>]] - Maximum flow 1 slpm
* [[Nitrogen|N<sub>2</sub>]] - Maximum flow 10 slpm
* [[Oxygen|O<sub>2</sub>]] - Maximum flow 500 sccm
* [[Silane|SiH<sub>4</sub>]] - Maximum flow 100 sccm

===Substrate requirements===
* [[Silicon]] only
* Can process up to 25, 150 mm (6") wafers
* Wafer thickness, ~675um for 150mm (6")
{{note|All samples must go through the [[RCA Bench 81|RCA Pre-Furnace clean]] procedure before being processed in the furnace|reminder}}

===Material restrictions===
{{material restrictions}}

==Supported processes== 
* [[Silicon dioxide|Low Temperature Oxide]] - LTO

===Process details===
* [https://docs.google.com/spreadsheets/d/1wKpGzR7e7tBbif4tP9mFr2wCP_0O6af_4OJullB_czY/preview#gid=111640208 Process recipe overview]

===Characterization data===
* [https://docs.google.com/spreadsheets/d/1DPVUueXKcS5yi2eVeMEi9YWwsClJPLewK-9MO3NWP-0/preview#gid=637685783 LTO]

==Standard operating procedure==
* [https://docs.google.com/document/d/1cm7cmmFzXGt6ULw2o99jbRWr_t8NZxHF1WpwqYQoADk/preview Quick reference SOP]
* [https://docs.google.com/document/d/12iBrxud7Ge4Pw6b4us1srWDu0t42nBhhx96OBM5pmeg/edit?usp=sharing Detailed SOP]

==Checkout procedure==
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Help desk Ticket] requesting training.
# LNF staff will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
# Schedule a checkout session with a tool engineer via the existing Helpdesk ticket. If this checkout is successful, the engineer will authorize you on the tool.

==Maintenance== 
* Maintenance is performed on the tool, after 30-40µm of accumulated deposition. 
* Maintenance consists of replacing the following quartz parts within the tube. 
** Cage
** Twin rods
** Bridge for twin rods
** Injectors
** Dummy wafers

* Tube is replaced at 100µm of accumulated deposition.