Tempress S2T1 Storage 4" & 6"
The Tempress S2T1 Storage 4" & 6" is used as a storage furnace for wafers/samples that have gone through the RCA pre-furnace clean procedure, prior to any clean furnace run. The wafers are stored in a Nitrogen ambient, at a temperature of 350°C.
| Tempress S2T1 Storage 4" & 6" | |
|---|---|
 | |
| Equipment Details | |
| Technology | Process Technology |
| Materials Restriction | CMOS Clean |
| Sample Size | 100mm and/or 150mm |
| Gases Used | N2 |
| Equipment Manual | |
| Overview | System Overview |
| Maintenance | Maintenance |
Contents
Announcements
- No announcements at this time.
Capabilities
- Wafer storage
System overview
Hardware details
- N2 - Maximum flow 10 slpm
- Temperature - 350°C
Substrate requirements
- Can process up to 25, 100mm (4"), and or, 150mm (6") wafers
- Wafer thickness, 525um for 100mm (4"), and 675um for 150mm (6")
- Maximum storage time is 72 hours
All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace
Material restrictions
The Tempress S2T1 Storage 4" & 6" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Approved materials
Supported processes
- Wafer storage
Process Details
- N/A
Characterization Data
- N/A
Standard operating procedure
- N/A
Checkout procedure
- Complete training and checkout on any of the other Tempress furnaces and the storage tube can be added if requested. Additional training is not necessary.
Maintenance
- TransLC clean - Once per year.