Tempress S2T2 - Nitride-HTO 4"

Tempress S2T2 - Nitride-HTO 4"
Equipment Details
Technology	LPCVD
Materials Restriction	CMOS Clean
Sample Size	100mm
Gases Used	N2, SiH2Cl2, N2O, NH3
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Nitride, HTO
Maintenance	Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. HTO (High Temperature Oxide), Nitride, Oxynitride, and Lower Stress Nitride are formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure.

Announcements

• The tube is having film quality issues and is not currently characterized. Users can run the tool but it is at your own risk. Please create a helpdesk ticket if you would like to run this tool.

Capabilities

• High Temperature Oxide (HTO)
• Silicon Nitride
• Oxynitride
• Lower Stress Nitride (LSN)

• Maximum Thickness
  • HTO = 2µm
  • Silicon Nitride = 7000Å
  • Oxynitride = 1µm
  • LSN = 2µm

System overview

Hardware details

• Maximum Temperature - 900°C
• N₂ - Maximum flow 10 slpm
• N₂ - Maximum flow 1000 sccm
• SiH₂Cl₂ - Maximum flow 200 sccm
• N₂O - Maximum flow 500 sccm
• NH₃ - Maximum flow 500 sccm

Substrate requirements

• Silicon only
• Can process up to 25, 100 mm (4") wafers
• Wafer thickness, ~525um for 100mm (4")

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S2T2 - Nitride-HTO 4" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

• High temperature oxide (HTO)
• Silicon nitride
• Oxynitride
• LSN

Process details

• Process recipe overview

Characterization data

• HTO
• Nitride
• Oxynitride
• LSN

Standard operating procedure

• Quick reference SOP
• detailed SOP

Checkout procedure

1. Create a Help desk Ticket requesting training.
2. LNF staff will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
3. Schedule a checkout session with a tool engineer via the existing Helpdesk ticket. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Paddle - cleaned every 3-6µm of accumulated deposition.
• Boats, and dummy wafers are replaced every 3-6 µm of accumulated deposition.
• Tube is replaced at 100µm of accumulated deposition.