Tempress S2T2 - Nitride-HTO 4"

Tempress S2T2 - Nitride-HTO 4"
Equipment Details
Technology	LPCVD
Materials Restriction	CMOS Clean
Sample Size	Pieces up to 150mm (6")
Gases Used	N2, SiH2Cl2, N2O, NH3
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
Maintenance	Maintenance

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The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. HTO (High Temperature Oxide), and Nitride, are formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure.

Announcements

• There are no announcements at this time.

Capabilities

• Nitride
• HTO (High Temperature Oxide)
• Maximum Thickness
  • Nitride = 7000 Å
  • HTO = 1.2 µm

System Overview

Hardware Details

• Maximum Temperature - 900°C
• N₂ - Maximum flow 10 slpm
• N₂ - Maximum flow 1000 sccm
• SiH₂Cl₂ - Maximum flow 200 sccm
• N₂O - Maximum flow 500 sccm
• NH₃ - Maximum flow 500 sccm

Substrate Requirements

• Silicon only
• Pieces up to 150mm (6")
• Can process up to 25, 150mm (6") wafers
• All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material Restrictions

The Tempress S2T2 - Nitride-HTO 4" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

• Nitride
• HTO (High Temperature Oxide)

Process Details

• Process recipe overview

Characterization Data

• Nitride

Standard Operating Procedure

• Standard operating procedure

Checkout Procedure

1. Read the Standard Operating Procedure above.
2. Create a Help desk Ticket requesting training.
3. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
4. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Paddle - cleaned every 3-6 µm of accumulated deposition
• Boats, and dummy wafers are cleaned, or replaced every 3-6 µm of accumulated deposition