Tempress S3T1 - Dry Oxide

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Thermal oxidation of silicon is achieved by heating the wafer to a high temperature, typically 900°C to 1100°C, in an atmosphere containing either pure oxygen, or water vapor. Both, oxygen and water vapor move easily through silicon dioxide at high temperatures. Oxygen then arriving at the silicon surface can then combine with the silicon to form silicon dioxide.

Tempress S3T1 - Dry Oxide
Equipment Details
Technology	Thermal processing
Materials Restriction	CMOS Clean
Sample Size	100mm and/or 150mm
Gases Used	N2, O2
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Dry Oxide
Maintenance	Maintenance

Contents

Announcements

• No announcements at this time.

Capabilities

• Dry oxide [[1]]
• Maximum Thickness - 3000 Å
• Maximum temperature - 1000°C

System Overview

• N₂ - Maximum flow 10 slpm
• N₂ - Maximum flow 1000 sccm
• O₂ - Maximum flow 10 slpm
• TransLC - used to clean tube as part of maintenance

Substrate Requirements

• Silicon only
• Can process up to 25, 100mm (4"), and or, 150mm (6") wafers
• Wafer thickness, 525um for 100mm (4"), and 675um for 150mm (6")

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material Restrictions

The Tempress S3T1 - Dry Oxide is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

• Dry oxide

Process Details

• Process recipe overview

Characterization Data

Standard Operating Procedure

• Quick reference SOP
• Detailed SOP

Checkout Procedure

1. Create a Help desk Ticket requesting training.
2. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
3. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• TransLC clean - Quarterly