Tempress S4T2 - PSG 4"

Tempress S4T2 - PSG 4"
Equipment Details
Technology	LPCVD
Materials Restriction	CMOS Clean
Sample Size	100mm
Gases Used	N2, O2, SiH4, 15% PH3/SiH4
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	PSG
Maintenance	Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. PSG (phosphorous silicate glass) is formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. PSG is achieved by adding a small amount of the dopant gas PH3 (Phosphine) to the deposition gas, Silane. The important factors are gas ratio, temperature, and pressure.

Announcements

• The tool is down with communication issues, and is no longer actively supported. If you need to run this tool please create a helpdesk ticket.

Capabilities

• PSG
• Maximum Thickness - 2µm

System overview

Hardware details

• N₂ - Maximum flow 1 slpm
• N₂ - Maximum flow 10 slpm
• O₂ - Maximum flow 500 sccm
• SiH₄ - Maximum flow 100 sccm
• 15% PH₃/SiH₄ - Maximum flow 200 sccm

Substrate requirements

• Silicon only
• Can process up to 25, 100 mm (4") wafers
• Wafer thickness, ~525um for 100mm (4")

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S4T2 - PSG 4" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

• PSG

Process details

• [Process recipe overview]

Characterization data

• PSG

Standard operating procedure

• Quick reference SOP
• Detailed SOP

Checkout procedure

1. Create a Help desk Ticket requesting training.
2. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
3. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Maintenance is performed on the tool, after 20µm of accumulated deposition.
• Maintenance consists of replacing the following quartz parts within the tube.
  • Cage
  • Twin rods
  • Bridge for twin rods
  • Thermocouple sheath
  • 5% PH₃/SiH₄ injector
  • Dummy wafers

• Tube is replaced at 100µm of accumulated deposition.