Tempress S4T3 - Flat Poly 6"

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Polysilicon, Low Stress Poly-Si, and Amorphous silicon are formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure.

Tempress S4T3 - Flat Poly 6"
Equipment Details
Technology	LPCVD
Materials Restriction	CMOS Clean
Sample Size	150mm
Gases Used	N2, SiH4, 5% BCL3/He
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	P-type in-situ doped polysilicon
Maintenance	Maintenance

Contents

Announcements

• No announcements at this time.

Capabilities

• Polysilicon
• Maximum Thickness - 2µm

System overview

Hardware details

• N₂ - Maximum flow 1000 sccm
• N₂ - Maximum flow 10 slpm
• SiH₄ - Maximum flow 300 sccm
• 5% BCL₃/He - Maximum flow 100 sccm

Substrate requirements

• Silicon only
• Can process up to 25, 150 mm (6") wafers
• Wafer thickness, ~675um for 150mm (6")

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S4T3 - Flat Poly 6" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

• Polysilicon

Process details

• Process recipe details

Characterization data

• Polysilicon

Standard operating procedure

• Quick reference SOP
• Detailed SOP

Checkout procedure

1. Create a Help desk Ticket requesting training.
2. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
3. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Maintenance is performed on the tool, after 20µm of accumulated deposition.
• Maintenance consists of replacing the following quartz parts within the tube.
  • Twin rods
  • Bridge for twin rods
  • Dummy wafers

• Tube is replaced at 100µm of accumulated deposition.