Tempress S4T3 - Flat Poly 6"

Tempress S4T3 - Flat Poly 6"
Equipment Details
Technology	LPCVD
Materials Restriction	CMOS Clean
Sample Size	150mm
Gases Used	N2, SiH4, 5% BCL3/He
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	P-type in-situ doped polysilicon
Maintenance	Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Polysilicon, Low Stress Poly-Si, and Amorphous silicon are formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure.

Announcements

• No announcements at this time.

Capabilities

• Polysilicon
• Maximum Thickness - 2µm

System overview

Hardware details

• N₂ - Maximum flow 1000 sccm
• N₂ - Maximum flow 10 slpm
• SiH₄ - Maximum flow 300 sccm
• 5% BCL₃/He - Maximum flow 100 sccm

Substrate requirements

• Silicon only
• Can process up to 25, 150 mm (6") wafers
• Wafer thickness, ~675um for 150mm (6")

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S4T3 - Flat Poly 6" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

• Polysilicon

Process details

• Process recipe details

Characterization data

• Polysilicon

Standard operating procedure

• Quick reference SOP
• Detailed SOP

Checkout procedure

1. Create a Help desk Ticket requesting training.
2. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
3. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Maintenance is performed on the tool, after 20µm of accumulated deposition.
• Maintenance consists of replacing the following quartz parts within the tube.
  • Twin rods
  • Bridge for twin rods
  • Dummy wafers

• Tube is replaced at 100µm of accumulated deposition.