Difference between revisions of "Tempress S5T3 - Boron Diffusion 4""

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* [[Oxygen|O<sub>2</sub>]] - Maximum flow 10 slpm
* [[Oxygen|O<sub>2</sub>]] - Maximum flow 10 slpm
* [[Oxygen|O<sub>2</sub>]] - Maximum flow 500 sccm
* [[Oxygen|O<sub>2</sub>]] - Maximum flow 500 sccm
* Boron solid sources
* Techneglas Boron solid sources
** [[GS139]] - 9 sources
** [[GS245]] - 9 sources
** [[GS245]] - 9 sources
** [[GS278]] - 9 sources
** [[GS278]] - 9 sources

Revision as of 14:51, 9 February 2017

Tempress S5T3 - Boron Diffusion 4"
Equipment Details
Technology Thermal processing
Materials Restriction CMOS Clean
Sample Size 100 mm (4")
Gases Used N2, O2
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Boron Diffusion
Maintenance Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Diffusion refers to the process of intentionally introducing impurities into an extremely pure semiconductor in order to change its electrical properties. The diffusion process begins with the deposition of a high concentration of the desired impurity on the silicon surface. At high temperature the impurity atoms move, from the surface, further into the silicon crystal.


  • There are no announcements at this time.


System overview

Hardware details

  • N2 - Maximum flow 10 slpm
  • O2 - Maximum flow 10 slpm
  • O2 - Maximum flow 500 sccm
  • Techneglas Boron solid sources

Substrate requirements

  • Silicon only
  • 100 mm (4") only
  • Can process up to 18, 100 mm wafers
All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S5T3 - Boron Diffusion 4" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported processes

Process details

Characterization data

  • N/A

Standard operating procedure

Checkout procedure

  1. Read the Standard Operating Procedure above.
  2. Create a Help desk Ticket requesting training.
  3. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
  4. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.


  • Replace Boron sources after 100 hours of use.