Tempress S6T4 - LTO 4"

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. LTO is formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure.

Tempress S6T4 - LTO 4"
Equipment Details
Technology	LPCVD
Materials Restriction	Metals
Sample Size	100mm
Gases Used	N2, O2, SiH4
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	LTO
Maintenance	Maintenance

Contents

Announcements

• The tool is down for a tube change.

Capabilities

• Low Temperature Oxide - LTO
• Maximum Thickness - 12µm

System overview

Hardware details

• N₂ - Maximum flow 10 slpm
• O₂ - Maximum flow 500 sccm
• SiH₄ - Maximum flow 1000 sccm

Substrate requirements

• Silicon only
• 100 mm (4")
• Can process up to 25, 100 mm (4") wafers
• A solvent clean must be performed on any samples prior to the run
  • 5 min clean Acetone
  • 5 min clean IPA
  • 5 min fresh clean Acetone
  • 5 min fresh clean IPA
  • 3 min DI rinse

Material restrictions

The Tempress S6T4 - LTO 4" is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

• Low Temperature Oxide - LTO

Process details

• Process recipe overview

Characterization data

• LTO

Standard operating procedure

• Quick reference SOP

Checkout procedure

1. Create a Help desk Ticket requesting training.
2. A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
3. Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

• Maintenance is performed on the tool, after 30-40µm of accumulated deposition.
• Maintenance consists of replacing the following quartz parts within the tube.
  • Cage
  • Twin rods
  • Bridge for twin rods
  • Thermocouple sheath
  • SiH₄ injector
  • O₂ injector
  • Dummy wafers

• Tube is replaced at 100µm of accumulated deposition.