Difference between revisions of "Wet chemical processing"

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*Gold electroplating
 
*Gold electroplating
 
*DC Source
 
*DC Source
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==Further reading==
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*[http://lnf-wiki.eecs.umich.edu/wiki/User_Resources#LNF_Tech_Talks_.28technology_seminar_series.29 LNF Tech Talk for Wet chemical processing is Coming Soon!]

Revision as of 12:33, 31 March 2020

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About this Process
Process Details
Equipment Wet chemical processing
Technology [[]]



Wet chemical processing is used for a variety of purposes, from chemical removal of material (wet etching) to deposition of material (electroplating), to sample cleaning, to the creation of patterns on the surface using optical lithography techniques. Many chemicals and materials can be handled in the LNF. To minimize the danger of incompatible materials mixing or cross-contaminating each other, different wet benches are designated for handling of different materials.

If you are unsure about a material or process, please create a helpdesk ticket.

Acid Processing

There are redundant processes in most of the benches. These benches are segregated by materials and by size of the sample processed. The details of the processing are on the bench page.

Acid Bench 02

  • CMOS Clean (furnace materials only)
  • 4" and 6" Silicon only
  • Dilute HF
  • Buffered HF
  • Hot Phosphoric Acid
  • Nanostrip

Acid Bench 12

  • 4" and 6" wafers
  • Silicon and glass wafers
  • Limited materials allowed
  • Nanostrip
  • Dilute HF
  • Buffered HF
  • Chrome Etch
  • Gold Etch

Acid Bench 72

  • 4" and 6" wafers only - this bench is only for tank processing
  • Most materials

Acid Bench 73

  • Small pieces to 6" wafers
  • Most materials
  • hot plate

Acid Bench 82

  • NOTE - this bench will be retired and taken offline to be replaced by Acid Bench 80
  • Small pieces to 6" wafers
  • Most materials

Acid Bench 92

  • HF:Nitric:Acetic
  • Plating
  • Piranha
  • Beaker processing
  • RCA Clean

Mask Bench 13

  • Mask processing only
  • Chrome etch
  • Mask cleaning

PFC Bench 01

  • CMOS clean
  • Furnace preparation only
  • RCA cleans

RCA Bench 81

  • Typically used for 4" wafers
  • If you need to clean pieces, please contact staff via the Helpdesk system
  • RCA cleaning

Base Processing

Developing

ACS 200 cluster tool

  • Automated
  • 4" and 6" wafers
  • AZ 300 and MF 319 only

Base Bench 63

  • Fragile devices that require manual developing
  • AZ 400K

Base Bench 91

  • KOH Processing

CEE Developers

  • Puddle developer station
  • 1cm2 pieces to 6" wafer
  • 4", 5" and 7" mask plates

Solvent Processing

Solvent Bench 14

  • 4" and 6" wafers
  • Silicon and glass wafer
  • Resist stripping
  • Liftoff
  • Wafer cleaning (PRS 2000)
  • Limited materials

E-Beam Spinner Hot-Plate Bench 21

  • 10mm x 10mm pieces up to 4" wafers
  • fully programmable, manual dispense spinner
  • This bench is used exclusively for E-beam lithography processing

E-Beam Solvent Bench 22

  • All size pieces
  • solvents, stripping resist, cleaning wafers, and liftoff
  • This bench is used exclusively for E-beam lithography processing

Solvent Bench 83

  • All sized pieces to 6" wafers
  • PRS 2000 tank

Solvent Bench 84

  • pieces to 6" wafers
  • Most materials
  • Resist stripping
  • Liftoff

Solvent Bench 94

  • Soft Lithography
  • SU8 processing
  • Polyimide processing

Other chemical processing

EDP Bench 93

Gold Plating

  • Pieces to 6" wafers
  • Gold electroplating
  • DC Source

Further reading