Wire Bonder

From LNF Wiki
Redirect page
Jump to navigation Jump to search
Wire Bonder
Equipment Details
Technology Packaging
Materials Restriction Undefined
Equipment Manual
Overview System overview
Operating Procedure SOP
Supported Processes Supported processes
User Processes User Processes
Maintenance Maintenance

The K&S 4123 Wire Bonder is a wedge bonder that is designed to connect bond pads on devices to the leads of a package such as DIP or TO-5 cases. It can also be used to interconnect bond pads between two devices, the same device or to a printed circuit board.