Wire Bonder
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| Wire Bonder | |
|---|---|
 | |
| Equipment Details | |
| Technology | Packaging |
| Materials Restriction | Undefined |
| Equipment Manual | |
| Overview | System overview |
| Operating Procedure | SOP |
| Supported Processes | Supported processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
The K&S 4123 Wire Bonder is a wedge bonder that is designed to connect bond pads on devices to the leads of a package such as DIP or TO-5 cases. It can also be used to interconnect bond pads between two devices, the same device or to a printed circuit board.
Announcements
- This K&S 4123 Wire Bonder was decommissioned on February 8th, 2021. Depending on your processing needs, please refer to either the MPP iBond 5000 Wedge Bonder or the MPP iBond 5000 Ball Bonder.
