Difference between revisions of "Wire bonding"
| Line 66: | Line 66: | ||
<!-- You can define a reference in the text using <ref name="NAME">[link.to.reference text to display]</ref> and it will add a footnote and then put the reference here.--> | <!-- You can define a reference in the text using <ref name="NAME">[link.to.reference text to display]</ref> and it will add a footnote and then put the reference here.--> | ||
<ref name="Methodofoperation">HYBOND, Inc. - About Wire Bonding[http://www.hybond.com/pages/wirebond-about.php]</ref> | <ref name="Methodofoperation">HYBOND, Inc. - About Wire Bonding[http://www.hybond.com/pages/wirebond-about.php]</ref> | ||
| − | + | <references /> | |
==Further reading== | ==Further reading== | ||
Revision as of 14:35, 21 January 2016
| Wire bonding | |
|---|---|
 | |
| Technology Details | |
| Other Names | %other names and abbreviations, separated by commas% |
| Technology | Technology |
| Equipment | List of Wire bonding equipment |
| Materials | %Optional materials processed% |
 Warning: | This page has not been released yet. |
Wire bonding can connect bond pads on devices to the leads of a package such as DIP or TO-5 cases. It can also be used to interconnect bond pads between two devices, the same device or to a printed circuit board.
Contents
Method of operation
Ultrasonic energy, when applied to metal to be bonded, renders it temporarily soft and plastic. This causes the metal to flow under pressure. The acoustic energy frees molecules and dislocates them from their pinned positions which allows the metal to flow under the low compressive forces of the bond.
The friction of the wire breaks up and sweeps aside some contaminants in the weld area exposing clean metallic surfaces which promote the metallurgical bonds. It is important, however, to begin with a clean surface to avoid difficulties or failures in bonding. In some cases the ultrasonic scrubbing may not be able to remove contaminants as in the case of lubricants. [1]
Parameters
The Force, Time, and Power controls are set for the best bond quality.
Force
The amount of additional pressure applied during the bond cycle
Time
The duration of the bond cycle
Power
The amount of ultrasonic energy applied during the bond cycle
Workholder Temperature
Heat applied to the sample during bonding. This is most useful for Gold and Platinum. Typical temperatures range from 100 to 150 degrees C.
Wedge heater Temperature
Heat is applied to the wedge when the workholder is heated. When used, the wedge heater is normally set to 36.
Subtechnology 1
Describe any sub-technologies of this technology.
Applications
Wire bonding is intended to create electrical interconnections in semiconductor chip packaging.
Materials
Wire bonding is best done with Gold and Aluminum pads. Other materials can be use also.
Equipment
The LNF has one wire bonder.
Equipment 1
The K&S 4123 Wire Bonder is a wedge bonder that is designed to connect bond pads on devices to the leads of a package such as DIP or TO-5 cases. It can also be used to interconnect bond pads between two devices, the same device or to a printed circuit board.
Complete tool list
See also
Other related wiki pages
References
Further reading
- Other stuff, e.g. technology workshop slides
- External links (can be in another section below, if appropriate)
[[Category:]]
