Xactix XeF2
Contents
Announcements
- A new easier to read SOP will be released shortly
System Overview
Widget text will go here.
Tool Capabilities/Limitations
- Uses XeF2 to etch Si
- 2 expansion chambers
- Capabilities
- Resolution
- Aspect Ratio
- Thickness range
Substrate Requirements
- Pieces to 6" wafer
- Up to 1 cm thick
Material Restrictions
Below is a list of approved and restricted materials for the tool. "Approved" means the material is allowed in the tool under normal circumstances. "Not Allowed" means the material may never be used in the tool. If a material is not listed, it may be possible to use the material under certain conditions. Please contact a tool engineer via the helpdesk ticket system for any material requests or questions.
Supported Processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:Xactix XeF2 User Processes|]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard Operating Procedure
Widget text will go here.
Checkout Procedure
- Read through the Standard Operating Procedure above.
- Take the SOP quiz here
- Create a helpdesk ticket requesting checkout.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Tool Qualification
Maintenance is performed on this tool every other week. This includes cleaning the chamber, checking the leak rates and performing
