Xenon difluoride etching

From LNF Wiki
Revision as of 13:36, 11 February 2016 by Kjvowen (talk | contribs) (Created page with "[[{{PAGENAME}}]] is a process that uses XeF<sub>2</sub> to etch specific materials. It is a highly selective etch, as...")
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

Xenon difluoride etching is a process that uses XeF2 to etch specific materials. It is a highly selective etch, as it spontaneously reacts at low pressures (3-5 Torr) with silicon, germanium, and molybdenum but is not reactive with other materials. It is often used as a release process.

Applications

Equipment

Main article: Xactix XeF2

The LNF has one XeF2 etcher, the Xactix Xetch X.3.B.