Xenon difluoride etching

Xenon difluoride etching is a process that uses XeF₂ to etch specific materials. It is a highly selective etch, as it spontaneously reacts at low pressures (3-5 Torr) with silicon, germanium, and molybdenum but is not reactive with other materials. It is often used as a release process.

Equipment

Main article: Xactix XeF2

The LNF has one XeF₂ etcher, the Xactix Xetch X.3.B.