Difference between revisions of "YES-CV200RFS(E)"
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|manufacturer = [http://www.yieldengineering.com/ Yield Engineering Systems] | |manufacturer = [http://www.yieldengineering.com/ Yield Engineering Systems] | ||
|model = CV200RFS(E) }} | |model = CV200RFS(E) }} | ||
| − | The [[{{PAGENAME}}]] is a single wafer, downstream [[Plasma etching#Plasma_ashing|plasma strip/descum]] tool designed by [http://www.yieldengineering.com/ Yield Engineering Systems]. It is designed for fast plasma stripping of [[photoresist]]s and other organic materials at up to 7000 Å/min. It can also be used for [[surface modification]] and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses [[oxygen]] plasma for organics removal, but it has been configured with three additional process gases ([[Ar]], [[Nitrogen|N<sub>2</sub>]], and [[Nitrogen trifluoride|NF<sub>3</sub>]]), for additional stripping and surface modification techniques. | + | The [[{{PAGENAME}}]] (referred to as the '''YES Plasma Stripper''' on the [[LNF Scheduler]]) is a single wafer, downstream [[Plasma etching#Plasma_ashing|plasma strip/descum]] tool designed by [http://www.yieldengineering.com/ Yield Engineering Systems]. It is designed for fast plasma stripping of [[photoresist]]s and other organic materials at up to 7000 Å/min. It can also be used for [[surface modification]] and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses [[oxygen]] plasma for organics removal, but it has been configured with three additional process gases ([[Ar]], [[Nitrogen|N<sub>2</sub>]], and [[Nitrogen trifluoride|NF<sub>3</sub>]]), for additional stripping and surface modification techniques. |
==Announcements== | ==Announcements== | ||
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{{note|Usage of custom recipes on the tool now require additional training. Please follow the instructions in the checkout procedure below. The access code will be changed on October 1, 2020 and any users who have not completed the procedure will no longer have access to the recipe editor.|reminder}} | {{note|Usage of custom recipes on the tool now require additional training. Please follow the instructions in the checkout procedure below. The access code will be changed on October 1, 2020 and any users who have not completed the procedure will no longer have access to the recipe editor.|reminder}} | ||
* [[{{PAGENAME}}#Super_user_checkout_procedure | Checkout procedure]] | * [[{{PAGENAME}}#Super_user_checkout_procedure | Checkout procedure]] | ||
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==Capabilities== | ==Capabilities== | ||
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==System overview== | ==System overview== | ||
| − | ===Hardware | + | ===Hardware details=== |
* Downstream RF plasma: up to 1000 W | * Downstream RF plasma: up to 1000 W | ||
* Heated chuck: 30°C – 200°C | * Heated chuck: 30°C – 200°C | ||
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===Material restrictions=== | ===Material restrictions=== | ||
| − | {{material | + | [[File:Etch_material_layers.png|right|diagram of typical material stack during an etch]] |
| + | The {{PAGENAME}} is designated as a [[{{#switch: {{#var:restriction}} | ||
| + | | 1 = CMOS Clean | ||
| + | | 2 = Semi-Clean | ||
| + | | 3 = Metals | ||
| + | | 4 = General | ||
| + | | Undefined | ||
| + | }}]] class tool. A full list of approved materials is included at the end of this section. In addition to the restrictions in this list, materials can be classified into four categories, detailed below: materials that may be '''etched''', materials that can be used as '''masks''', '''etch stop''' materials, and '''buried''' materials. Use of any material outside of these conditions requires approval by the LNF staff via a helpdesk ticket. | ||
| + | |||
| + | ====Materials etched==== | ||
| + | Any ''lab supported'' [[photoresist]] may be etched in this tool. Other approved polymers include PDMS, parylene, and polyimide. The tool may also be used to clean wafers (no etched film). For etching any materials other than these, LNF approval is required via a helpdesk ticket. | ||
| + | |||
| + | ====Mask and etch stop materials==== | ||
| + | This includes any material that will be exposed to the plasma during the process. Materials listed in the Approved materials list are allowed. Any other materials must be approved by the LNF via a helpdesk ticket. | ||
| + | |||
| + | ====Approved materials==== | ||
| + | Below is a list of approved materials for the tool. ''Approved'' means the material is allowed in the tool under the conditions described above. If a material is not listed, please create a helpdesk ticket or email [mailto:info@umich.edu info@lnf.umich.edu] for any material requests or questions. | ||
| + | |||
| + | <div class="NavFrame" style="font-size:100%;margin:0;border-style:none;padding:0;"> | ||
| + | <div class="NavFrame" style="border-style:solid;background:#fff;padding:0.2em;"> | ||
| + | <div class="NavHead" style="background:#ddd;text-align:center;">{{Big|Approved materials}}</div> | ||
| + | <div class="NavContent" style="text-align:left;">{{#widget:ApprovedMaterials|toolid={{#var:toolid}}{{{1|}}}|header=N}}</div> | ||
| + | </div> | ||
| + | </div> | ||
==Supported processes== | ==Supported processes== | ||
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==Standard operating procedure== | ==Standard operating procedure== | ||
| − | + | '''[https://drive.google.com/file/d/10HJbxRzMlYwAw6onGxglvg99YJ9GDhmE/view?usp=sharing PDF Copy]''' | |
| − | + | ||
| − | + | {{#widget:GoogleDoc|key=1BIA91s15C-1ja4j1KIjTy3KRzyjeq0Fjywk2CdsCTtA}} | |
==Checkout procedure== | ==Checkout procedure== | ||
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==Maintenance== | ==Maintenance== | ||
| − | The chamber is disassembled and cleaned | + | * A leak check and plasma clean is performed monthly |
| + | * The chamber is disassembled and cleaned twice a year | ||
===User authorized maintenance=== | ===User authorized maintenance=== | ||
The only maintenance that users are authorized to perform is tool startup in the event of a power bump. Please see the [https://docs.google.com/document/d/13gVIzr2tf87rtDnioNH-qU8P1Vk_1km3w7d9oy-PnRA/preview Startup and Shutdown Procedure] for more details. | The only maintenance that users are authorized to perform is tool startup in the event of a power bump. Please see the [https://docs.google.com/document/d/13gVIzr2tf87rtDnioNH-qU8P1Vk_1km3w7d9oy-PnRA/preview Startup and Shutdown Procedure] for more details. | ||
Revision as of 07:59, 24 May 2021
| YES-CV200RFS(E) | |
|---|---|
 | |
| Equipment Details | |
| Manufacturer | Yield Engineering Systems |
| Model | CV200RFS(E) |
| Technology | Plasma etching |
| Materials Restriction | Metals |
| Material Processed | photoresist, polymers |
| Sample Size | pieces up to 8" wafers |
| Gases Used |
O2 Ar N2 NF3 |
| Equipment Manual | |
| User Manual | User Manual |
| Overview | System overview |
| Supported Processes | Supported processes |
| Maintenance | Maintenance |
The YES-CV200RFS(E) (referred to as the YES Plasma Stripper on the LNF Scheduler) is a single wafer, downstream plasma strip/descum tool designed by Yield Engineering Systems. It is designed for fast plasma stripping of photoresists and other organic materials at up to 7000 Å/min. It can also be used for surface modification and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses oxygen plasma for organics removal, but it has been configured with three additional process gases (Ar, N2, and NF3), for additional stripping and surface modification techniques.
Contents
Announcements
9/1/2020
Capabilities
- Photoresist descum (600 Å/min)
- Photoresist stripping (6000 Å/min)
- High temperature plasma cleaning/organics etching
- PDMS surface activation
- Sacrificial polymer layer release
- Fluorocarbon removal in high aspect ratio structures
System overview
Hardware details
- Downstream RF plasma: up to 1000 W
- Heated chuck: 30°C – 200°C
- Gases: O2, Ar, N2, NF3
Substrate requirements
- Handles up to 8” wafers and wafer pieces
- Single wafer processing (or dual 4" wafers)
- Max sample thickness: 3 mm
Material restrictions
The YES-CV200RFS(E) is designated as a Metals class tool. A full list of approved materials is included at the end of this section. In addition to the restrictions in this list, materials can be classified into four categories, detailed below: materials that may be etched, materials that can be used as masks, etch stop materials, and buried materials. Use of any material outside of these conditions requires approval by the LNF staff via a helpdesk ticket.
Materials etched
Any lab supported photoresist may be etched in this tool. Other approved polymers include PDMS, parylene, and polyimide. The tool may also be used to clean wafers (no etched film). For etching any materials other than these, LNF approval is required via a helpdesk ticket.
Mask and etch stop materials
This includes any material that will be exposed to the plasma during the process. Materials listed in the Approved materials list are allowed. Any other materials must be approved by the LNF via a helpdesk ticket.
Approved materials
Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under the conditions described above. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
The tool is provided with 6 characterized recipes, shown in the table below. Process time is chosen on the main panel before starting the recipe. The original process times for recipes 1, 2, and 4 have been included for reference. If you need process adjustment beyond this, please consult a tool engineer before creating a recipe to be authorized to edit recipes, and please do not save over the 6 supported recipes. There are 12 recipe slots in total, please save your recipe to one of 7-12. We cannot guarantee that it will be there for your next run, so remember to write down your settings.
| Purpose | Chamber clean | Strip photoresist | Descum | Strip KMPR | ||
|---|---|---|---|---|---|---|
| (prev) 3 μm | any | (prev) 200 Å | any | any | ||
| Recipe # | 1 | 2 | 3 | 4 | 5 | 6 |
| Time (sec) | (prev) 300 | (prev) 360 | var. | (prev) 20 | var. | var. |
| Chuck temp. (°C) | 60 | 150 | 60 | 150 | ||
| O2 flow (sccm) | 50 | 80 | 35 | 80 | ||
| NF3 flow (sccm) | 0 | 0 | 0 | 8 | ||
| Power (W) | 800 | 800 | 100 | 800 | ||
| Etch rate (Å/min) | 5000 | 600 | ||||
| Uniformity (%) | 1.5 | 20 | ||||
Use of custom recipes requires additional training. Please see the checkout procedure below. Custom recipes may be documented on YES-CV200RFS(E) User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
Widget text will go here.
Checkout procedure
Follow this procedure to receive authorization to run supported processes. Practicing with an authorized user or staff member is strongly recommended but not required.
- Read this page and the user manual.
- Accurately complete the checkout quiz (you may retake if necessary).
- Create a helpdesk ticket requesting authorization.
- Given successful completion of the quiz, a tool engineer will authorize you on the tool.
Super user checkout procedure
- Complete the process request form and create a helpdesk ticket.
- Review the procedure provided in the ticket response.
- Accurately complete the quiz provided in the ticket response.
- Arrange a training session with a tool engineer via the ticket.
- Given successful completion of the quiz and demonstration of proper tool operation, a tool engineer will provide the access code. Do not share the access code.
Maintenance
- A leak check and plasma clean is performed monthly
- The chamber is disassembled and cleaned twice a year
User authorized maintenance
The only maintenance that users are authorized to perform is tool startup in the event of a power bump. Please see the Startup and Shutdown Procedure for more details.
