Difference between revisions of "YES-CV200RFS(E)"

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{{#vardefine:toolid|10061}} <!-- Set the resource ID, 5 digit # found on the scheduler -->{{
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{{#vardefine:toolid|10061}}
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#vardefine:technology|Plasma etching}} <!-- Set the Process Technology (see subcategories on Equipment page) -->{{
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#vardefine:restriction|3}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals -->{{
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{{#vardefine:technology|Plasma etching}}
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infobox equipment
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{{#vardefine:restriction|3}}
 
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{{infobox equipment
 
 
|caption =  
 
|caption =  
 
|materials = [[photoresist]], [[polymers]]
 
|materials = [[photoresist]], [[polymers]]
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|chemicals =  
 
|chemicals =  
 
|gases = [[Oxygen|O<sub>2</sub>]]<br>[[Argon|Ar]]<br>[[Nitrogen|N<sub>2</sub>]]<br>[[Nitrogen trifluoride|NF<sub>3</sub>]]
 
|gases = [[Oxygen|O<sub>2</sub>]]<br>[[Argon|Ar]]<br>[[Nitrogen|N<sub>2</sub>]]<br>[[Nitrogen trifluoride|NF<sub>3</sub>]]
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|overview = [[{{PAGENAME}}#System_Overview | System Overview]]
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|manual = [https://docs.google.com/document/d/1BIA91s15C-1ja4j1KIjTy3KRzyjeq0Fjywk2CdsCTtA/preview User Manual]
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|sop = [https://docs.google.com/document/d/19PctJdqREy4frN86fx64_3rUvEWrNNYzJGmFwif_978/preview SOP]
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|overview = [[{{PAGENAME}}#System_overview | System overview]]
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|processes = [https://docs.google.com/document/d/1DZ8SI3aaDfWiGep59aFnqrxW6jufzdZ9JXu8U5ckWW4/preview Supported Processes]
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|processes = [[{{PAGENAME}}#Supported_processes | Supported processes]]
 
|userprocesses =  
 
|userprocesses =  
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
|manufacturer = [http://www.yieldengineering.com/ Yield Engineering Systems]
 
|manufacturer = [http://www.yieldengineering.com/ Yield Engineering Systems]
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|model = CV200RFS(E)
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|model = CV200RFS(E) }}
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}}
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The [[{{PAGENAME}}]] (referred to as the '''YES Plasma Stripper''' on the [[LNF Scheduler]]) is a single wafer, downstream [[Plasma etching#Plasma_ashing|plasma strip/descum]] tool designed by [http://www.yieldengineering.com/ Yield Engineering Systems].  It is designed for fast plasma stripping of [[photoresist]]s and other organic materials at up to 7000 Å/min.  It can also be used for [[surface modification]] and gentle surface cleaning.  It supports pieces and wafers from 2” to 8” and wafer pieces.  The tool mainly uses [[oxygen]] plasma for organics removal, but it has been configured with three additional process gases ([[Ar]], [[Nitrogen|N<sub>2</sub>]], and [[Nitrogen trifluoride|NF<sub>3</sub>]]), for additional stripping and surface modification techniques.
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The YES-CV200RFS(E) is a single wafer, downstream [[Plasma etching|plasma strip/descum]] tool designed by Yield Engineering Systems.  It is designed for fast plasma stripping of [[photoresist]]s and other organic materials at up to 7000 Å/min.  It can also be used for [[surface modification]] and gentle surface cleaning.  It supports pieces and wafers from 2” to 8” and wafer pieces.  The tool mainly uses [[oxygen]] plasma for organics removal, but it has been configured with three additional process gases ([[Ar]], [[Nitrogen|N<sub>2</sub>]], and [[Nitrogen trifluoride|NF<sub>3</sub>]]), for additional stripping and surface modification techniques.
 
  
 
==Announcements==
 
==Announcements==
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No announcements at this time
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'''9/1/2020'''
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{{note|Usage of custom recipes on the tool now require additional training. Please follow the instructions in the checkout procedure below. The access code will be changed on October 1, 2020 and any users who have not completed the procedure will no longer have access to the recipe editor.|reminder}}
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* [[{{PAGENAME}}#Super_user_checkout_procedure | Checkout procedure]]
  
 
==Capabilities==
 
==Capabilities==
 
* Photoresist descum (600 Å/min)
 
* Photoresist descum (600 Å/min)
 
* Photoresist stripping (6000 Å/min)
 
* Photoresist stripping (6000 Å/min)
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* High temperature plasma cleaning of organics
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* High temperature plasma cleaning/organics etching
 
* [[PDMS]] surface activation
 
* [[PDMS]] surface activation
 
* Sacrificial polymer layer release
 
* Sacrificial polymer layer release
 
* [[Fluorocarbon]] removal in high aspect ratio structures
 
* [[Fluorocarbon]] removal in high aspect ratio structures
  
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==System Overview==
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==System overview==
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===Hardware Details===
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===Hardware details===
 
* Downstream RF plasma: up to 1000 W
 
* Downstream RF plasma: up to 1000 W
 
* Heated chuck: 30°C – 200°C
 
* Heated chuck: 30°C – 200°C
 
* Gases: O<sub>2</sub>, Ar, N<sub>2</sub>, NF<sub>3</sub>
 
* Gases: O<sub>2</sub>, Ar, N<sub>2</sub>, NF<sub>3</sub>
  
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===Substrate Requirements===
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===Substrate requirements===
 
* Handles up to 8” wafers and wafer pieces
 
* Handles up to 8” wafers and wafer pieces
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* Single wafer processing
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* Single wafer processing (or dual 4" wafers)
 
* Max sample thickness: 3 mm
 
* Max sample thickness: 3 mm
  
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===Material Restrictions===
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===Material restrictions===
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{{material restrictions}}
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[[File:Etch_material_layers.png|right|diagram of typical material stack during an etch]]
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The {{PAGENAME}} is designated as a [[{{#switch: {{#var:restriction}}
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| 1 = CMOS Clean
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| 2 = Semi-Clean
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| 3 = Metals
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| 4 = General
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| Undefined
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}}]] class tool. A full list of approved materials is included at the end of this section. In addition to the restrictions in this list, materials can be classified into four categories, detailed below: materials that may be '''etched''', materials that can be used as '''masks''', '''etch stop''' materials, and '''buried''' materials. Use of any material outside of these conditions requires approval by the LNF staff via a helpdesk ticket.
  
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==Supported Processes==  
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====Materials etched====
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The tool is provided with 6 characterized recipes, shown in the table below. Three of these recipes (3, 5 and 6) have variable times that you can change to suit your needs. If you need process adjustment beyond this, please consult a tool engineer before creating a recipe to be authorized to edit recipes, and please do not save over the 6 supported recipes. There are 12 recipe slots in total, please save your recipe to one of 7-12. We cannot guarantee that it will be there for your next run, so remember to write down your settings.
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Any ''lab supported'' [[photoresist]] may be etched in this tool. Other approved polymers include PDMS, parylene, and polyimide. The tool may also be used to clean wafers (no etched film). For etching any materials other than these, LNF approval is required via a helpdesk ticket.
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 +
====Mask and etch stop materials====
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This includes any material that will be exposed to the plasma during the process. Materials listed in the Approved materials list are allowed. Any other materials must be approved by the LNF via a helpdesk ticket.
 +
 
 +
====Approved materials====
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Below is a list of approved materials for the tool. ''Approved'' means the material is allowed in the tool under the conditions described above. If a material is not listed, please create a helpdesk ticket or email [mailto:info@umich.edu info@lnf.umich.edu] for any material requests or questions.
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  <div class="NavFrame" style="border-style:solid;background:#fff;padding:0.2em;">
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    <div class="NavHead" style="background:#ddd;text-align:center;">{{Big|Approved materials}}</div>
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    <div class="NavContent" style="text-align:left;">{{#widget:ApprovedMaterials|toolid={{#var:toolid}}{{{1|}}}|header=N}}</div>
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  </div>
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</div>
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==Supported processes==  
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The tool is provided with 6 characterized recipes, shown in the table below. Process time is chosen on the main panel before starting the recipe. The original process times for recipes 1, 2, and 4 have been included for reference. If you need process adjustment beyond this, please consult a tool engineer before creating a recipe to be authorized to edit recipes, and please do not save over the 6 supported recipes. There are 12 recipe slots in total, please save your recipe to one of 7-12. We cannot guarantee that it will be there for your next run, so remember to write down your settings.
  
 
{| class="wikitable" border="1" style="text-align: center"
 
{| class="wikitable" border="1" style="text-align: center"
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! colspan="2" | Strip photoresist  
 
! colspan="2" | Strip photoresist  
 
! colspan="2" | Descum
 
! colspan="2" | Descum
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! Strip KMPR
 
|-  
 
|-  
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! 3 μm !! any !! 200 Å !! any
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! (prev) 3 μm !! any !! (prev) 200 Å !! any !! any
 
|-  
 
|-  
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! Recipe # !! 1 !! 2 !! 3 !! 4 !! 5
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! Recipe # !! 1 !! 2 !! 3 !! 4 !! 5 !! 6
 
|-  
 
|-  
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| '''Time (sec)''' || 300 || 360 || var. || 20 || var.
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| '''Time (sec)''' || (prev) 300 || (prev) 360 || var. || (prev) 20 || var. || var.
 
|-
 
|-
 
| '''Chuck temp. (°C)''' || 60
 
| '''Chuck temp. (°C)''' || 60
 
| colspan="2" | 150
 
| colspan="2" | 150
 
| colspan="2" | 60
 
| colspan="2" | 60
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| 150
 
|-
 
|-
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| '''O<sub>2</sub> flow (sccm)''' || 100
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| '''O<sub>2</sub> flow (sccm)''' || 50
 
| colspan="2" | 80
 
| colspan="2" | 80
 
| colspan="2" | 35
 
| colspan="2" | 35
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| 80
 
|-
 
|-
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| '''Power (W)''' || 1000
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| '''NF<sub>3</sub> flow (sccm)''' || 0
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| colspan="2" | 0
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| colspan="2" | 0
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| 8
 +
|-
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| '''Power (W)''' || 800
 
| colspan="2" | 800
 
| colspan="2" | 800
 
| colspan="2" | 100
 
| colspan="2" | 100
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| 800
 
|-
 
|-
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| '''Etch rate (Å/min)''' || N/A
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| '''Etch rate (Å/min)''' ||  
 
| colspan="2" | 5000
 
| colspan="2" | 5000
 
| colspan="2" | 600
 
| colspan="2" | 600
 +
|
 
|-
 
|-
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| '''Uniformity (%)''' || N/A
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| '''Uniformity (%)''' ||  
 
| colspan="2" | 1.5
 
| colspan="2" | 1.5
 
| colspan="2" | 20
 
| colspan="2" | 20
 +
|
 
|}
 
|}
  
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Custom recipes may be created and saved in slots 7-12. For instructions on how to use the recipe editor, please follow the guide in section F of the SOP (below). For some guidelines on recipe development, please review the [https://docs.google.com/document/d/1DZ8SI3aaDfWiGep59aFnqrxW6jufzdZ9JXu8U5ckWW4/preview standard processes] document. Custom recipes may be documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
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Use of custom recipes requires additional training. Please see the [[{{PAGENAME}}#Super_user_checkout_procedure | checkout procedure]] below. Custom recipes may be documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 +
 
 +
==Standard operating procedure==
 +
'''[https://drive.google.com/file/d/10HJbxRzMlYwAw6onGxglvg99YJ9GDhmE/view?usp=sharing PDF Copy]'''
 +
 
 +
{{#widget:GoogleDoc|key=1BIA91s15C-1ja4j1KIjTy3KRzyjeq0Fjywk2CdsCTtA}}
  
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==Standard Operating Procedure==
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==Checkout procedure==
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<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
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Follow this procedure to receive authorization to run supported processes. Practicing with an authorized user or staff member is strongly recommended but not required.
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{{#widget:GoogleDoc|key=19PctJdqREy4frN86fx64_3rUvEWrNNYzJGmFwif_978}}
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# Read this page and the [https://docs.google.com/document/d/1BIA91s15C-1ja4j1KIjTy3KRzyjeq0Fjywk2CdsCTtA/preview user manual].
 +
# Accurately complete the [https://docs.google.com/forms/d/e/1FAIpQLScO2ww44I-yWO5of79tBhYEdsKA3t-KqhlBq1bg-5sgMtpaVQ/viewform?usp=sf_link checkout quiz] (you may retake if necessary).
 +
# Create a helpdesk ticket requesting authorization.
 +
# Given successful completion of the quiz, a tool engineer will authorize you on the tool.
  
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==Checkout Procedure==
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===Super user checkout procedure===
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The following steps should be taken to gain access to the tool:
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# Complete the [https://docs.google.com/forms/d/e/1FAIpQLSfgiDv7_WOe_a0F3FPPf2QtZTn2xNUAJlCful_o15C5T1WJlw/viewform?usp=sf_link process request form] and create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket].
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# Read through this page and the Standard Operating Procedure above.
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# Review the procedure provided in the ticket response.
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# Practice on the tool with a qualified user
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# Accurately complete the quiz provided in the ticket response.
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# Complete the checkout quiz found [https://docs.google.com/a/lnf.umich.edu/spreadsheet/viewform?formkey=dEg0Slk3LVhfWlVLZW9oYXo4ZnNISVE6MQ#gid=0|here]
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# Arrange a training session with a tool engineer via the ticket.
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting checkout. If this checkout is successful, the engineer will authorize you on the tool.
+
# Given successful completion of the quiz and demonstration of proper tool operation, a tool engineer will provide the access code. Do not share the access code.
  
 
==Maintenance==  
 
==Maintenance==  
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The chamber is disassembled and cleaned once per quarter and process condition is verified.
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* A leak check and plasma clean is performed monthly
 +
* The chamber is disassembled and cleaned twice a year
  
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===User Authorized Maintenance===
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===User authorized maintenance===
 
The only maintenance that users are authorized to perform is tool startup in the event of a power bump. Please see the [https://docs.google.com/document/d/13gVIzr2tf87rtDnioNH-qU8P1Vk_1km3w7d9oy-PnRA/preview Startup and Shutdown Procedure] for more details.
 
The only maintenance that users are authorized to perform is tool startup in the event of a power bump. Please see the [https://docs.google.com/document/d/13gVIzr2tf87rtDnioNH-qU8P1Vk_1km3w7d9oy-PnRA/preview Startup and Shutdown Procedure] for more details.

Revision as of 07:59, 24 May 2021

YES-CV200RFS(E)
10061.jpg
Equipment Details
Manufacturer Yield Engineering Systems
Model CV200RFS(E)
Technology Plasma etching
Materials Restriction Metals
Material Processed photoresist, polymers
Sample Size pieces up to 8" wafers
Gases Used O2
Ar
N2
NF3
Equipment Manual
User Manual User Manual
Overview System overview
Supported Processes Supported processes
Maintenance Maintenance


The YES-CV200RFS(E) (referred to as the YES Plasma Stripper on the LNF Scheduler) is a single wafer, downstream plasma strip/descum tool designed by Yield Engineering Systems. It is designed for fast plasma stripping of photoresists and other organic materials at up to 7000 Å/min. It can also be used for surface modification and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses oxygen plasma for organics removal, but it has been configured with three additional process gases (Ar, N2, and NF3), for additional stripping and surface modification techniques.

Announcements

9/1/2020

Usage of custom recipes on the tool now require additional training. Please follow the instructions in the checkout procedure below. The access code will be changed on October 1, 2020 and any users who have not completed the procedure will no longer have access to the recipe editor.

Capabilities

  • Photoresist descum (600 Å/min)
  • Photoresist stripping (6000 Å/min)
  • High temperature plasma cleaning/organics etching
  • PDMS surface activation
  • Sacrificial polymer layer release
  • Fluorocarbon removal in high aspect ratio structures

System overview

Hardware details

  • Downstream RF plasma: up to 1000 W
  • Heated chuck: 30°C – 200°C
  • Gases: O2, Ar, N2, NF3

Substrate requirements

  • Handles up to 8” wafers and wafer pieces
  • Single wafer processing (or dual 4" wafers)
  • Max sample thickness: 3 mm

Material restrictions

diagram of typical material stack during an etch

The YES-CV200RFS(E) is designated as a Metals class tool. A full list of approved materials is included at the end of this section. In addition to the restrictions in this list, materials can be classified into four categories, detailed below: materials that may be etched, materials that can be used as masks, etch stop materials, and buried materials. Use of any material outside of these conditions requires approval by the LNF staff via a helpdesk ticket.

Materials etched

Any lab supported photoresist may be etched in this tool. Other approved polymers include PDMS, parylene, and polyimide. The tool may also be used to clean wafers (no etched film). For etching any materials other than these, LNF approval is required via a helpdesk ticket.

Mask and etch stop materials

This includes any material that will be exposed to the plasma during the process. Materials listed in the Approved materials list are allowed. Any other materials must be approved by the LNF via a helpdesk ticket.

Approved materials

Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under the conditions described above. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

The tool is provided with 6 characterized recipes, shown in the table below. Process time is chosen on the main panel before starting the recipe. The original process times for recipes 1, 2, and 4 have been included for reference. If you need process adjustment beyond this, please consult a tool engineer before creating a recipe to be authorized to edit recipes, and please do not save over the 6 supported recipes. There are 12 recipe slots in total, please save your recipe to one of 7-12. We cannot guarantee that it will be there for your next run, so remember to write down your settings.

Purpose Chamber clean Strip photoresist Descum Strip KMPR
(prev) 3 μm any (prev) 200 Å any any
Recipe # 1 2 3 4 5 6
Time (sec) (prev) 300 (prev) 360 var. (prev) 20 var. var.
Chuck temp. (°C) 60 150 60 150
O2 flow (sccm) 50 80 35 80
NF3 flow (sccm) 0 0 0 8
Power (W) 800 800 100 800
Etch rate (Å/min) 5000 600
Uniformity (%) 1.5 20

Use of custom recipes requires additional training. Please see the checkout procedure below. Custom recipes may be documented on YES-CV200RFS(E) User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

PDF Copy

Widget text will go here.

Checkout procedure

Follow this procedure to receive authorization to run supported processes. Practicing with an authorized user or staff member is strongly recommended but not required.

  1. Read this page and the user manual.
  2. Accurately complete the checkout quiz (you may retake if necessary).
  3. Create a helpdesk ticket requesting authorization.
  4. Given successful completion of the quiz, a tool engineer will authorize you on the tool.

Super user checkout procedure

  1. Complete the process request form and create a helpdesk ticket.
  2. Review the procedure provided in the ticket response.
  3. Accurately complete the quiz provided in the ticket response.
  4. Arrange a training session with a tool engineer via the ticket.
  5. Given successful completion of the quiz and demonstration of proper tool operation, a tool engineer will provide the access code. Do not share the access code.

Maintenance

  • A leak check and plasma clean is performed monthly
  • The chamber is disassembled and cleaned twice a year

User authorized maintenance

The only maintenance that users are authorized to perform is tool startup in the event of a power bump. Please see the Startup and Shutdown Procedure for more details.

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