|Manufacturer||Yield Engineering Systems|
|Material Processed||photoresist, polymers|
|Sample Size||pieces up to 8" wafers|
|Supported Processes||Supported Processes|
The YES-CV200RFS(E) is a single wafer, downstream plasma strip/descum tool designed by Yield Engineering Systems. It is designed for fast plasma stripping of photoresists and other organic materials at up to 7000 Å/min. It can also be used for surface modification and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses oxygen plasma for organics removal, but it has been configured with three additional process gases (Ar, N2, and NF3), for additional stripping and surface modification techniques.
- Photoresist descum (600 Å/min)
- Photoresist stripping (6000 Å/min)
- High temperature plasma cleaning/organics etching
- PDMS surface activation
- Sacrificial polymer layer release
- Fluorocarbon removal in high aspect ratio structures
- Downstream RF plasma: up to 1000 W
- Heated chuck: 30°C – 200°C
- Gases: O2, Ar, N2, NF3
- Handles up to 8” wafers and wafer pieces
- Single wafer processing
- Max sample thickness: 3 mm
The YES-CV200RFS(E) is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email email@example.com for any material requests or questions.
The tool is provided with 6 characterized recipes, shown in the table below. Process time is chosen on the main panel before starting the recipe. The original process times for recipes 1, 2, and 4 have been included for reference. If you need process adjustment beyond this, please consult a tool engineer before creating a recipe to be authorized to edit recipes, and please do not save over the 6 supported recipes. There are 12 recipe slots in total, please save your recipe to one of 7-12. We cannot guarantee that it will be there for your next run, so remember to write down your settings.
|Purpose||Chamber clean||Strip photoresist||Descum||Strip KMPR|
|(prev) 3 μm||any||(prev) 200 Å||any||any|
|Time (sec)||(prev) 300||(prev) 360||var.||(prev) 20||var.||var.|
|Chuck temp. (°C)||60||150||60||150|
|O2 flow (sccm)||50||80||35||80|
|NF3 flow (sccm)||0||0||0||8|
|Etch rate (Å/min)||5000||600|
Custom recipes may be created and saved in slots 7-12. For instructions on how to use the recipe editor, please follow the guide in section F of the SOP (below). For some guidelines on recipe development, please review the standard processes document. Custom recipes may be documented on YES-CV200RFS(E) User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard Operating Procedure
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The following steps should be taken to gain access to the tool:
- Read through this page and the Standard Operating Procedure above.
- Practice on the tool with a qualified user
- Complete the checkout quiz found here
- Create a Helpdesk Ticket requesting checkout. If this checkout is successful, the engineer will authorize you on the tool.
Super User Checkout Procedure
The chamber is disassembled and cleaned once per quarter and process condition is verified.
User Authorized Maintenance
The only maintenance that users are authorized to perform is tool startup in the event of a power bump. Please see the Startup and Shutdown Procedure for more details.