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Equipment Details
Manufacturer Yield Engineering Systems
Model CV200RFS(E)
Technology Plasma etching
Materials Restriction Metals
Material Processed photoresist, polymers
Sample Size pieces up to 8" wafers
Gases Used O2
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance

The YES-CV200RFS(E) is a single wafer, downstream plasma strip/descum tool designed by Yield Engineering Systems. It is designed for fast plasma stripping of photoresists and other organic materials at up to 7000 Å/min. It can also be used for surface modification and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses oxygen plasma for organics removal, but it has been configured with three additional process gases (Ar, N2, and NF3), for additional stripping and surface modification techniques.


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  • Photoresist descum (600 Å/min)
  • Photoresist stripping (6000 Å/min)
  • High temperature plasma cleaning of organics
  • PDMS surface activation
  • Sacrificial polymer layer release
  • Fluorocarbon removal in high aspect ratio structures

System Overview

Hardware Details

  • Downstream RF plasma: up to 1000 W
  • Heated chuck: 30°C – 200°C
  • Gases: O2, Ar, N2, NF3

Substrate Requirements

  • Handles up to 8” wafers and wafer pieces
  • Single wafer processing
  • Max sample thickness: 3 mm

Material Restrictions

The YES-CV200RFS(E) is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email for any material requests or questions.

Supported Processes

The tool is provided with 6 characterized recipes, shown in the table below. Three of these recipes (3, 5 and 6) have variable times that you can change to suit your needs. If you need process adjustment beyond this, please consult a tool engineer before creating a recipe to be authorized to edit recipes, and please do not save over the 6 supported recipes. There are 12 recipe slots in total, please save your recipe to one of 7-12. We cannot guarantee that it will be there for your next run, so remember to write down your settings.

Purpose Chamber clean Strip photoresist Descum
3 μm any 200 Å any
Recipe # 1 2 3 4 5
Time (sec) 300 360 var. 20 var.
Chuck temp. (°C) 60 150 60
O2 flow (sccm) 100 80 35
Power (W) 1000 800 100
Etch rate (Å/min) N/A 5000 600
Uniformity (%) N/A 1.5 20

Custom recipes may be created and saved in slots 7-12. For instructions on how to use the recipe editor, please follow the guide in section F of the SOP (below). For some guidelines on recipe development, please review the standard processes document. Custom recipes may be documented on YES-CV200RFS(E) User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

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Checkout Procedure

The following steps should be taken to gain access to the tool:

  1. Read through this page and the Standard Operating Procedure above.
  2. Practice on the tool with a qualified user
  3. Complete the checkout quiz found [1]
  4. Create a Helpdesk Ticket requesting checkout. If this checkout is successful, the engineer will authorize you on the tool.


The chamber is disassembled and cleaned once per quarter and process condition is verified.

User Authorized Maintenance

The only maintenance that users are authorized to perform is tool startup in the event of a power bump. Please see the Startup and Shutdown Procedure for more details.